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? 2016 microchip technology inc. ds60001403a - page 1 BM62/64 features ? qualified for bluetooth v4.2 specifications ? worldwide regulatory certifications are planned ? supports hfp 1.6, hsp 1.2, a2dp 1.3, spp 1.2, avrcp 1.6 ? supports bluetooth (br/edr/ble) specifications (fw dependent) ? stand-alone module with on-board pcb antenna and bluetooth stack ? supports high resolution up to 24-bit, 96 khz audio data format ? supports to connect two hosts with hfp/a2dp profiles simultaneously ? transparent uart mode for seamless serial data over uart interface ? supports virtual uart cable transport between host mcu and smartphone applications by blue- tooth spp or ble link ? easy to configure with windows ? gui or directly by external mcu ? supports firmware field upgrade ? supports 1 microphone ? compact surface mount module: - BM62: 29 x 15 x 2.5 mm - bm64: 32 x 15 x 2.5 mm ? castellated surface mount pads for easy and reliable host pcb mounting ? rohs compliant ? ideal for portable battery operated devices ? internal battery regulator circuitry rf/analog ? frequency spectrum: 2.402 ghz to 2.480 ghz ? receive sensitivity: -90 dbm (2 mbps edr) ? class 2 output power (+2 dbm typical) for BM62, bm64 and class 1 output power (+15 dbm typi- cal) for bm64 dsp audio processing ? supports 64 kbps a-law, ? -law pcm format/ continuous variable slope delta (cvsd) modula- tion for sco channel operation ? supports 8/16 khz noise suppression ? supports 8/16 khz echo cancellation ? sbc and optional aac decoding ? packet loss concealment (plc) ? supports serial copy management system (scms-t) content protection figure 1: BM62 module figure 2: bm64 module audio codec ? sbc and optional aac decoding ? 20-bit digital-to-analog (dac) with 96 db snr ? 16-bit analog-to-digital (adc) with 90 db snr ? up to 24-bit, 96 khz i 2 s digital audio bluetooth ? 4.2 stereo audio module
BM62/64 ds60001403a - page 2 ? 2016 microchip technology inc. peripherals ? built-in lithium-ion and lithium-polymer battery charger (up to 350 ma) ? integrated 1.8v and 3v configurable switching regulator and low-dropout (ldo) ? built-in adc for battery monitoring and voltage sense ? built-in adc for charger thermal protection ? built-in undervoltage protection (uvp) ? an aux-in port for external audio input ? two led drivers ? multiple i/o pins for control and status hci interface ? high-speed hci-uart interface (supports up to 921,600 bps) mac/baseband processor ? supports bluetooth 4.2 dual mode (fw depen- dent) - br/edr transport for audio, voice, and spp data exchange - ble transport for proprietary transparent service and ancs data exchange operating condition ? operating voltage: 3.2v to 4.2v ? operating temperature: -20c to +70c compliance ? bluetooth sig qdid: 83345 (BM62, bm64 class 2) and 83336 (bm64 class 1) ? certifications planned for the united states (fcc), canada (ic), european economic area (ce), korea (kcc), taiwan (ncc), japan (jrf), and china (srrc) applications ? soundbar and subwoofer ? bluetooth speaker ? multi-speaker description the BM62/64 stereo audio module is a fully qualified bluetooth 4.2 dual-mode module for designers to add wireless audio and voice applications to their products. the BM62/64 module is a bluetooth special interest group (sig) certified module that provides a complete wireless solution with bluetooth stack, integrated pcb antenna, and worldwide radio certifications in a compact surface-mount package. the BM62/64 module has several skus. the BM62 is a class 2 device and the bm64 is available in both class 1 and class 2 versions.
? 2016 microchip technology inc. ds60001403a - page 3 BM62/64 table of content 1.0 device overview ............................................................................................................ .......................................... 5 2.0 audio ...................................................................................................................... ................................................ 15 3.0 transceiver ............................................................................................................... ............................................. 19 4.0 power management unit ...................................................................................................... ................................. 21 5.0 application information .................................................................................................... ...................................... 23 6.0 printed antenna information ................................................................................................ .................................. 39 7.0 physical dimensions........................................................................................................ ....................................... 43 8.0 electrical characteristics ................................................................................................ ........................................ 47 9.0 soldering recommendations .................................................................................................. ............................... 55 10.0 ordering information ...................................................................................................... ...................................... 57 appendix a: certification notices.............................................................................................. ................................... 59 appendix b: revision history................................................................................................... .................................... 65 to our valued customers it is our intention to provide our valued customers with the best documentation possible to ensure successful use of your micro chip products. to this end, we will continue to improve our publications to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regar ding this publication, please contact the marketing communications department via e-mail at docerrorsmicrochip.com or fax the reader response form in the back of this data sheet to (480) 792-4150. we wel- come your feedback. most current data sheet to obtain the most up-to-date version of this data s heet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . the last character of the literature number is the versi on number, (e.g., ds30000000a is ve rsion a of document ds30000000). errata an errata sheet, describing minor operational differences fr om the data sheet and recommended workarounds, may exist for curren t devices. as device/documentation i ssues become known to us, we will publish an errata sheet. the errata will specify the revisi on of silicon and revision of document to which it applies. to determine if an errata sheet exists for a particul ar device, please check with one of the following: ? microchip?s worldwide web site; http://www.microchip.com ? your local microchip sales office (see last page) when contacting a sales office, please spec ify which device, revision of silicon and data sheet (include literature number) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products.
BM62/64 ds60001403a - page 4 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds60001403a - page 5 BM62/64 1.0 device overview the BM62 and bm64 stereo audio modules are built around microchip technology is2062 and is2064 socs. the is2062/64 soc integrates the bluetooth 4.2 dual- mode radio transceiver, power management unit (pmu), crystal and dsp. users can configure the BM62/64 module using the ui tool and dsp tool, a win- dows-based utility. figure 1-1 illustrates a typical example of the BM62 module which is connected to an external audio amplifier and the mcu. figure 1-1: applicatio n using BM62 module figure 1-2 illustrates a typical example of the class 1 bm64 module which is connected to an external mcu and a dsp/codec. figure 1-2: applicat ion using bm64 module
BM62/64 ds60001403a - page 6 ? 2016 microchip technology inc. figure 1-3 and figure 1-4 illustrate the bm64 module in soundbar or subwoofer applications. figure 1-3: soundbar and subwoof er applications using bm64 figure 1-4: soundbar and subwoofer ap plications using bm64, smartphone figure 1-5 illustrates the bm64 module in a multi-speaker application. figure 1-5: multi-speaker application using bm64
? 2016 microchip technology inc. ds60001403a - page 7 BM62/64 table 1-1 provides the key features of the BM62/64 module. table 1-1: BM62/64 key features feature BM62 class2 bm64 class2 bm64 class1 application headset/speaker multi-speaker/soundbar/subwoofer stereo/mono stereo stereo stereo pin count 37 43 43 dimensions (mm 2 ) 15 x 29 15 x 32 15 x 32 pcb antenna yes yes yes tx power (typical) 2 dbm 2 dbm 15 dbm audio dac output 2 channel 2 channel 2 channel dac (single-ended) snr at 2.8v (db) -98 -98 -98 dac (capless) snr at 2.8v (db) -98 -98 -98 adc snr at 2.8v (db) -92 -92 -92 i 2 s digital interface no yes yes analog aux-in yes yes yes mono mic 1 1 1 external audio amplifier interface yes yes yes uart yes yes yes led driver 2 2 2 internal dc-dc step-down regulator yes yes yes dc 5v adapter input yes yes yes battery charger (350 ma max.) yes yes yes adc for thermal charger protection yes yes yes undervoltage protection (uvp) yes yes yes gpio 10 12 12 button support 6 6 6 nfc (triggered by external nfc) yes yes yes eeprom yes yes yes customized voice prompt store in eeprom multi-tone yes yes yes dsp sound effect yes yes yes bluetooth profiles hfp 1.6 1.6 1.6 avrcp 1.6 1.6 1.6 a2dp 1.3 1.3 1.3 hsp 1.2 1.2 1.2 spp 1.2 1.2 1.2
BM62/64 ds60001403a - page 8 ? 2016 microchip technology inc. figure 1-6 illustrates the pin diagram of the BM62 module. figure 1-6: BM62 pin diagram
? 2016 microchip technology inc. ds60001403a - page 9 BM62/64 table 1-2 provides the pin description of the BM62 module. table 1-2: BM62 pin description pin no pin type pin name description 1 i/o p0_0 configurable control or indication pin (internally pulled-up if configured as an input) ? slide switch detector ?uart tx_ind 2 i ean external address-bus negative system configuration pin along with the p2_0 and p2_4 pins, used to set the module in any one of the fol- lowing three modes: ? application mode (for normal operation) ? test mode (to change eeprom values) ? write flash mode (to enter a new firmware into the module), refer to tab l e 5 - 1 rom: must be pulled high to vdd_io flash: must be pulled down with 4.7 kohm to gnd 3 i/o p3_0 configurable control or indication pin (internally pulled-up, if configured as an input) aux-in detector 4 i/o p2_0 system configuration pin along with p2_4 and ean pins, used to set the module in any one of the following three modes: ? application mode (for normal operation) ? test mode (to change eeprom values), ? write flash mode (to enter a new firmware into the module), refer to tab l e 5 - 1 5 i/o p1_5 configurable control or indication pin (internally pulled-up, if configured as an input) ? nfc detection pin ? out_ind_1 ? slide switch detector 6 i/o p0_4 configurable control or indication pin (internally pulled-up, if configured as an input) ? nfc detection pin ? out_ind_1 7 o spkr analog headphone output, right channel 8 o aohpm headphone common mode output/sense input 9 o spkl analog headphone output, left channel 10 p vdda analog reference voltage. do not connect, for internal use only 11 i mic1_p mic1 mono differential analog positive input 12 i mic1_n mic1 mono differential analog negative input 13 p mic1_bias electric microphone biasing voltage 14 i air right-channel, single-ended analog input 15 i ail left-channel, single-ended analog input 16 i rst_n system reset (active-low) 17 - nc no connection
BM62/64 ds60001403a - page 10 ? 2016 microchip technology inc. legend: i= input pin o= output pin i/o= input/output pin p= power pin note: these pins can be configured using the ui tool, a windows utility. 18 i/o p0_1 configurable control or indication pin (internally pulled-up, if configured as an input) fwd key 19 p vdd_io i/o positive supply. do not connect. for internal use only 20 p adap_in 5v power adaptor input 21 p bat_in battery input, voltage range: 3.2v to 4.2v 22 p amb_det analog input for ambient temperature detection 23 p gnd ground reference 24 p sys_pwr system power output 25 p bk_out 1.8v buck output. do not connect to other devices. for internal use only, 26 i mfb multi-function button 27 i led1 led driver 1 28 i led2 led driver 2 29 i/o p2_4 system configuration pin along with p2_0 and ean pins, used to set the module in any one of the following three modes: ? application mode (for normal operation) ? test mode (to change eeprom values) ? write flash mode (to enter the new firmware into the module), refer to tab le 5 -1 30 i/o p0_2 configurable control or indication pin (internally pulled-up if configured as an input) play/pause key as the default setting 31 i/o p0_3 configurable control or indication pin (internally pulled-up if configured as an input) ? rev key ? buzzer signal output ? out_ind_2 32 i/o hci_txd hci uart data output 33 i/o hci_rxd hci uart data output 34 i/o p0_5 configurable control or indication pin (internally pulled-up if configured as an input) volume-down key (default) 35 i/o p2_7 configurable control or indication pin (internally pulled-up if configured as an input) volume-up key (default) 36 - nc no connection 37 p gnd ground reference 38 - nc no connection 39 - nc no connection 40 - nc no connection table 1-2: BM62 pin description (continued) pin no pin type pin name description
? 2016 microchip technology inc. ds60001403a - page 11 BM62/64 figure 1-7 illustrates the pin diagram of the bm64 module. figure 1-7: bm64 pin diagram
BM62/64 ds60001403a - page 12 ? 2016 microchip technology inc. table 1-3 provides the bm64 pin descriptions. table 1-3: bm64 pin description pin no pin type name description 1idr0i 2 s interface: digital left/right data 2i/orfs0i 2 s interface: left/right cock 3i/osclk0i 2 s interface: bit clock 4odt0i 2 s interface: digital left/right data 5 o aohpr headphone output, right channel 6 o aohpm headphone common mode output/sense input 7 o aohpl headphone output, left channel 8 i mic_n1 mic1 mono differential analog negative input 9 i mic_p1 mic1 mono differential analog positive input 10 p mic_bias electric microphone biasing voltage 11 i air right-channel single-ended analog input 12 i ail left-channel single-ended analog input 13 i rst_n system reset (active-low) 14 p gnd ground reference 15 i/o p1_2 eeprom clock scl 16 i/o p1_3 eeprom data sda 17 i/o p0_4 configurable control or indication pin (internally pulled-up if configured as an input) nfc detection pin, active-low, out_ind_1 18 i/o p1_5 configurable control or indication pin (internally pulled-up if configured as an input) ? nfc detection pin ? slide switch detector, active-high ? out_ind_1. ? multi-spk master/slave mode control (fw dependent) 19 i hci_rxd hci-uart data input 20 o hci_txd hci-uart data output 21 p vdd_io i/o positive supply. do not connect, for internal use only 22 p bat_in battery input. voltage range: 3.2v to 4.2v 23 p adap_in 5v power adaptor input 24 p sys_pwr system power output 25 p amb_det analog input for ambient temperature detection 26 i mfb multi-function button and power-on key uart rx_ind, active high 27 i led2 led driver 2 28 i led1 led ddiver 1 29 i/o p3_7 configurable control or indication pin (internally pulled-up if configured as an input) uart tx_ind, active-low 30 i/o p3_5 configurable control or indication pin (internally pulled-up if configured as an input) slide switch detector, active-high 31 i/o p0_0 configurable control or indication pin (internally pulled-up if configured as an input) slide switch detector, active-high, out_ind_0
? 2016 microchip technology inc. ds60001403a - page 13 BM62/64 legend: i= input pin o= output pin i/o= input/output pin p= power pin note: these pins can be configured by using the ui tool, a windows utility. 32 i ean external address-bus negative system configuration pin along with the p2_0 pin used to set the module in any one of these modes: ? application mode (for normal operation) ? test mode (to change eeprom values) ? write flash mode (to enter new firmware into the module) refer to table 5-1 rom: must be pulled high to vdd_io flash: must be pulled down with 4.7 kohm to gnd 33 i/o dm differential data-minus usb 34 i/o dp differential data-plus usb 35 i/o p0_5 configurable control or indication pin (internally pulled-up if configured as an input) volume-down key (default) 36 i/o p3_0 configurable control or indication pin (internally pulled-up if configured as an input) aux-in detector 37 i/o p3_1 configurable control or indication pin (internally pulled-up if configured as an input) rev key (default), active low 38 i/o p3_3 configurable control or indication pin (internally pulled-up if configured as an input) fwd key, active-low 39 i/o p3_6 configurable control or indication pin (internally pulled-up if configured as an input) multi-spk master/slave mode control, fw dependent 40 i/o p0_2 configurable control or indication pin (internally pulled-up if configured as an input) play/pause key as the default setting 41 i/o p2_0 system configuration pin along with ean pin, used to set the module in any one of the following modes: ? application mode (for normal operation) ? test mode (to change eeprom values) ? write flash mode (to enter the new firmware into the module), refer to tab le 5 - 1 42 i/o p2_7 configurable control or indication pin (internally pulled-up if configured as an input) volume-up key (default) 43 p gnd ground reference table 1-3: bm64 pin description (continued) pin no pin type name description
BM62/64 ds60001403a - page 14 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds60001403a - page 15 BM62/64 2.0 audio the input and output audios have different stages and each stage can be programmed to vary the gain response characteristics. for microphone, both sin- gle-ended inputs and differential inputs are supported. to maintain a high quality signal, a stable bias voltage source to the condenser microphone?s fet is provided. dc blocking capacitors can be used at both positive and negative sides of a input. internally, this analog sig- nal is converted to 16-bit, 8 khz linear pcm data. 2.1 digital signal processor a digital signal processor (dsp) is used to perform speech and audio processing. the advanced speech features, such as acoustic echo cancellation and noise reduction are in-built. to reduce nonlinear distortion and help echo cancellation, an outgoing signal level to the speaker will exceed the threshold (and therefore likely to create echo). this may result in suppression of the signal. adaptive filtering is also applied to track the echo path impulse in response to provide echo free and full-duplex user experience. the embedded noise reduction algorithm helps to extract clean speech sig- nals from the noisy inputs captured by microphones and improves mutual understanding in communication. advanced audio features, such as multi-band dynamic range control, parametric multi-band equalizer, audio widening and virtual bass are in-built. the audio effect algorithms are to improve the user?s audio listening experience in terms of better quality after audio signal processing. figure 2-1 and figure 2-2 illustrate the processing flow of speaker-phone applications for speech and audio signal processing. figure 2-1: speech processing figure 2-2: audio processing
BM62/64 ds60001403a - page 16 ? 2016 microchip technology inc. the dsp parameters can be configured using the dsp tool. for additional information, refer to the ? is206x dsp application note ?. 2.2 codec the built-in codec has a high signal-to-noise ratio (snr) performance. this built-in codec consist of an analog-to-digital converter (adc), a digital-to-analog converter (dac) and an additional analog circuitry. figure 2-3 through figure 2-6 illustrate the dynamic range and frequency response of the codec. figure 2-3: codec dac dynamic range figure 2-4: codec dac thd+n versus input power note: the dsp tool is a windows-based config- uration tool, which is available for down- load from the microchip web site at: www.microchip.com/BM62 and www.microchip.com/bm64 . note: the data corresponds to 16 ohm load with 2.8v operating voltage at 25c room temperature. note: the data corresponds to 16 ohm load with 2.8v operating voltage at 25c room temperature.
? 2016 microchip technology inc. ds60001403a - page 17 BM62/64 figure 2-5: codec dac frequency response (capless mode) figure 2-6: codec dac frequency response (single-ended mode) note: the frequency response corresponds to single-ended mode with a 47 uf dc block capacitor.
BM62/64 ds60001403a - page 18 ? 2016 microchip technology inc. 2.3 auxiliary port the BM62/64 module supports one analog (line-in) sig- nal from external audio source. the analog (line-in) sig- nal can be processed by the dsp to generate different sound effects (multi-band dynamic range compression and audio widening), which can be set up by using the dsp tool. 2.4 analog speaker output the BM62/64 module supports the following speaker output modes: ? capless mode ? commended for headphone applications in which capless output connection helps to save the bom cost by avoiding a large dc blocking capacitor. figure 2-7 illustrates the analog speaker output capless mode. ? single-ended mode ? used for driving an exter- nal audio amplifier where a dc blocking capacitor is required. figure 2-8 illustrates the analog speaker output single-ended mode. figure 2-7: capless mode figure 2-8: single-ended mode
? 2016 microchip technology inc. ds60001403a - page 19 BM62/64 3.0 transceiver the BM62/64 module is designed and optimized for bluetooth 2.4 ghz system. it contains a complete radio frequency transmitter/receiver section. an internal syn- thesizer generates a stable clock for synchronizing with another device. 3.1 transmitter the internal power amplifier (pa) has a maximum out- put power of +4 dbm. this is applied for class 2 or class 3 radios without an external rf pa. the transmitter performs iq conversion to minimize the frequency drift. 3.2 receiver the low-noise amplifier (lna) operates with tr-com- bined mode for single port application. it can save a pin on package without having an external tx/rx switch. the adc is used to sample the input analog signal and convert it into digital signal for de-modulator analysis. a channel filter has been integrated into receiver channel before the adc, which is used to reduce the external component count and increase the anti-interference capability. the image rejection filter is used to reject image frequency for low-if architecture. this filter for low-if architecture is intented to reduce external band pass filter (bpf) component for super heterodyne architecture. received signal strength indicator (rssi) signal feed- back to the processor is used to control the rf output power to make a good trade-off for effective distance and current consumption. 3.3 synthesizer a synthesizer generates a clock for radio transceiver operation. there is a vco inside, with a tunable inter- nal lc tank that can reduce variation for components. a crystal oscillator with internal digital trimming circuit provides a stable clock for synthesizer. 3.4 modem for bluetooth 1.2 specification and below, 1 mbps was the standard data rate based on gaussian frequency shift keying (gfsk) modulation scheme. this basic rate modem meets basic data rate (bdr) require- ments of bluetooth 2.0 with enhanced data rate (edr) specification. for bluetooth 2.0 and above specifications, edr has been introduced to provide data rates of 2 mbps, 3 mbps and 1 mbps. for baseband, both bdr and edr utilize the same 1 mhz symbol rate and 1.6 khz slot rate. for bdr, symbol 1 represents 1-bit. however, each symbol in the payload part of edr packet rep- resents 2/3 bits. this is achieved by using two different modulations, /4 dqpsk and 8 dpsk. 3.5 adaptive frequency hopping (afh) the BM62/64 module has afh function to avoid rf interference. it has an algorithm to check the nearby interference and to choose clear channel for transceiver bluetooth signal.
BM62/64 ds60001403a - page 20 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds60001403a - page 21 BM62/64 4.0 power management unit the on-chip power management unit (pmu) has two main features: lithium-ion and lithium-polymer battery charger, and voltage regulation. a power switch is used to switch over the power source between the battery and adaptor. also, the pmu provides current to drive two leds. 4.1 charging a battery the BM62/64 module has a built-in battery charger which is optimized for lithium-ion and lithium-polymer batteries. the charger includes a current sensor for charging control, user programmable current regulation, and high accuracy voltage regulation. the charging current parameters are configured by the ui tool. reviving, pre-charging, constant current and constant voltage modes, and re-charging functions are included. the maximum charging current is 350 ma. figure 4-1 illus- trates the charging curve of a battery. figure 4-1: charging curve 4.2 voltage monitoring a 10-bit, successive approximation adc (sar adc) provides a dedicated channel for voltage level detec- tion. the warning level can be programmed by using the ui tool. the adc provides a granular resolution to enable the mcu to take control over the charging pro- cess. 4.3 led driver two dedicated led drivers control the leds.they pro- vide enough sink current (16 step control and 0.35 ma for each step), thus leds can be connected directly with the BM62/64 module. led settings can be config- ured using the ui tool. figure 4-2 illustrates the led drivers in the BM62/64 module.
BM62/64 ds60001403a - page 22 ? 2016 microchip technology inc. figure 4-2: led driver 4.4 under voltage protection when the sys_pwr voltage is less than 2.9v, the sys- tem will shutdown. 4.5 ambient detection the BM62/64 module has a built-in adc for charger thermal protection. figure 4-3 illustrates the suggested circuit and thermistor, murata ncp15wf104f. the charger thermal protection can avoid battery charge in restricted temperature range. the upper and lower limits for temperature values can be configured using the ui tool. figure 4-3: ambient detection
? 2016 microchip technology inc. ds60001403a - page 23 BM62/64 5.0 application information 5.1 host mcu interface the BM62/64 module supports uart commands. the uart commands enable an external mcu to control the BM62/64 module. figure 5-1 illustrates the uart interface between the BM62/64 module and mcu. an external mcu can control the BM62/64 module over the uart interface and wake-up the module with the mfb pins, p0_0 (BM62) and p3_7 (bm64). refer to the ?uart_commandset? document for a list of functions the BM62/64 module supports, and how to use the ui tool to configure uart and uart com- mand set tool. figure 5-1: host mcu interface over uart note: the uart command set tool (spkcom- mandsettool v160.xx) is available for download from the microchip web site at: www.microchip.com/BM62 and www.microchip.com/bm64 .
BM62/64 ds60001403a - page 24 ? 2016 microchip technology inc. figure 5-2 through figure 5-7 illustrate the various uart control signal timing sequences. figure 5-2: power on/off sequence
? 2016 microchip technology inc. ds60001403a - page 25 BM62/64 figure 5-3: rx timing se quence (power- on state) figure 5-4: timing sequence (power off state) note 1: eeprom clock = 100 khz. 2: for a byte write: 0.01 ms x 32 clock x 2 = 640 s. 3: it is recommended to have ramp-down time more than 640 s during power-off sequence to ensure safe operation of the device.
BM62/64 ds60001403a - page 26 ? 2016 microchip technology inc. figure 5-5: timing sequence of power on (nack) figure 5-6: reset timing sequence in no response from module to host mcu note: when mcu sends the uart command and the BM62/64 module does not respond, the mcu resends the uart command. if the BM62/64 module does not respond within 5 secs, the mcu will force the system to reset.
? 2016 microchip technology inc. ds60001403a - page 27 BM62/64 figure 5-7: timing sequence of power drop protection 5.2 i 2 s mode application the bm64 module provides an i 2 s digital audio output interface to connect with the external codec/dsp. it provides 8, 16, 44.1, 48, 88.2, and 96 khz sampling rate for 16-bit and 24-bit data formats. the i 2 s setting can be configured by using the ui and dsp tools. figure 5-8 and figure 5-9 illustrate the i 2 s signal con- nection between the bm64 module and an external dsp. use the dsp tool to configure the bm64 module as a master/slave. for additional information on timing specifications, refer to 8.2?timing specifications? . figure 5-8: bm64 in i 2 s master mode note 1: it is recommended to use battery to provide the power supply at bat_in in to the module. 2: if an external power source or a power adapter is utilized to provide power to the module (adap_in), it is recommended to use a voltage supervisor ic. 3: the reset ic output pin, rst_n, must be ?open drain? with delay time Q 10 ms and recommended part is g691l293t73 .
BM62/64 ds60001403a - page 28 ? 2016 microchip technology inc. figure 5-9: slave mode reference connection 5.3 reset the BM62/64 module provides a watchdog timer (wdt) to reset the chip. it has an integrated power-on reset (por) circuit that resets all circuits to a known power-on state. this action can also be driven by an external reset signal which is used to control the device externally by forcing it into a por state. the rst_n signal input is active-low and no connection is required in most applications. note: the ui and dsp tools can be down- loaded from the microchip web site: www.microchip.com/BM62 and www.microchip.com/bm64 .
? 2016 microchip technology inc. ds60001403a - page 29 BM62/64 5.4 external configuration and programming the BM62/64 module can be configured using an external configuration tool (eeprom tool) and firm- ware is programmed using a programming tool (flash tool). figure 5-10 illustrates the configuration and firmware programming interface on the BM62 module. it is recommended to include a header pin on the main pcb for development. figure 5-10: external prog ramming header connections configuration and firmware programming modes are entered according to the system configuration i/o pins. table 5-1 provides the system configuration settings. the p2_ 0, p2_4 and ean pins have internal pull up . note: the eeprom tool and flash tool are available for download from the microchip web site at: www.microchip.com/BM62 and www.microchip.com/bm64 . table 5-1: system configuration settings p2_0 p2_4 ean operating mode high high low (flash), high (rom) app mode (normal operation) low high low (flash), high (rom) test mode (write eeprom) low low high write flash (BM62 only)
BM62/64 ds60001403a - page 30 ? 2016 microchip technology inc. 5.5 reference circuit figure 5-11 through figure 5-14 illustrate the BM62 module reference circuit for a stereo headset application. figure 5-11: BM62 reference circuit for stereo headset
? 2016 microchip technology inc. ds60001403a - page 31 BM62/64 figure 5-12: BM62 reference circuit for stereo headset
BM62/64 ds60001403a - page 32 ? 2016 microchip technology inc. figure 5-13: BM62 reference circuit for stereo headset note: the section ?nfc (optional)? contains built-in rectifier circuit of nxp 203f nfc type.
? 2016 microchip technology inc. ds60001403a - page 33 BM62/64 figure 5-14: BM62 reference circuit for stereo headset note: all esd diodes in the schematics are reserved for testing.
BM62/64 ds60001403a - page 34 ? 2016 microchip technology inc. figure 5-15 through figure 5-18 illustrate the bm64 reference circuit for a stereo headset application. figure 5-15: bm64 reference circuit for stereo headset
? 2016 microchip technology inc. ds60001403a - page 35 BM62/64 figure 5-16: bm64 reference circuit for stereo headset
BM62/64 ds60001403a - page 36 ? 2016 microchip technology inc. figure 5-17: bm64 reference circuit for stereo headset
? 2016 microchip technology inc. ds60001403a - page 37 BM62/64 figure 5-18: bm64 reference circuit for stereo headset
BM62/64 ds60001403a - page 38 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds60001403a - page 39 BM62/64 6.0 printed antenna information 6.1 antenna radiation pattern the BM62/64 module has one pcb printed antenna, see figure 6-1 . figure 6-2 illustrates the radiation pattern of the pcb printed antenna. figure 6-1: keep out area recommended for antenna
BM62/64 ds60001403a - page 40 ? 2016 microchip technology inc. figure 6-2: antenna 3d radi ation pattern at 2441 mh z 6.2 module pl acement guidelines for a bluetooth product, the antenna placement affects the performance of the whole system. the antenna requires free space to radiate rf signals and it cannot be surrounded by the ground plane. microchip recommends that the areas underneath the antenna on the host pcb must not contain copper on top, inner, or bottom layer as illustrated in figure 6-1 . a low-impedance ground plane will ensure the best radio performance (best range, lowest noise). the ground plane can be extended beyond the minimum recommen- dation, as required for the main pcb emc noise reduc- tion. for the best range performance, keep all external metal at least 15 mm away from the on-board pcb trace antenna. figure 6-3 and figure 6-4 illustrate examples of good and poor placement of the BM62/64 module on a host board with gnd plane. table 6-1: BM62/64 antenna characteristics parameter values frequency 2400 mhz ~ 2480 mhz peak gain 1.927 dbi efficiency 73.41%
? 2016 microchip technology inc. ds60001403a - page 41 BM62/64 figure 6-3: module pl acement guidelines figure 6-4: gnd plane on main application board
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? 2016 microchip technology inc. ds60001403a - page 43 BM62/64 7.0 physical dimensions figure 7-1 illustrates the BM62 module pcb dimension and figure 7-2 illustrates the bm64 module pcb dimension. figure 7-1: BM62 pcb dimension
BM62/64 ds60001403a - page 44 ? 2016 microchip technology inc. figure 7-2: bm64 pcb dimension
? 2016 microchip technology inc. ds60001403a - page 45 BM62/64 figure 7-3 illustrates the recommended pcb footprint for the BM62 module, and figure 7-4 illustrates the rec- ommended pcb footprint.for the bm64 module. figure 7-3: recommended BM62 pcb footprint note 1: the ?keep out area? is reserved to keep the rf test point away from gnd plane. 2: "all metal keep out" is to isolate the pcb antenna.
BM62/64 ds60001403a - page 46 ? 2016 microchip technology inc. figure 7-4: recommended bm64 pcb footprint note 1: the ?keep out area? is reserved to keep the rf test point away from gnd plane. 2: "all metal keep out" is to isolate the pcb antenna.
? 2016 microchip technology inc. ds60001403a - page 47 BM62/64 8.0 electrical characteristics this section provides an overview of the BM62/64 stereo audio module electrical characteristics. additional information will be provided in future revisions of this document as it becomes available. absolute maximum ratings for the BM62/64 devices are listed below. exposure to these maximum rating conditions for extended periods may affect device reliability. functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. 8.1 absolute maximum ratings ambient temperature under bias................................................................................................. ............. .-20c to +70c voltage on vdd with respect to v ss ........................................................................................................ -0.3v to +3.6v maximum output current sink by any i/o pin..................................................................................... .....................12 ma maximum output current sourced by any i/o pin.................................................................................. ..................12 ma note: stresses listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only. the functional operation of the device at those or any other conditions and those indicated in the operation listings of this specification, is not implied. exposure to maximum rating condi- tions for extended periods may affect device reliability.
BM62/64 ds60001403a - page 48 ? 2016 microchip technology inc. note 1: absolute and recommended operating condition tables reflect typical usage for device. note 1: these parameters are characterized but not tested in manufacturing. note 1: headroom = v adap_in ? v bat 2: when v adap_in ? v bat > 2v, the maximum fast charge current is 175 ma for thermal protection. 3: these parameters are characterized but not tested in manufacturing. note 1: test condition: bk_o = 1.8v with temperature +25 oc. 2: these parameters are characterized but not tested in manufacturing. table 8-1: recommended operating condition symbol parameter min typical max unit bat_in input voltage for battery 3.2 3.8 4.2 v adap_in input voltage for adaptor 4.5 5 5.5 v t operation operation temperature -20 +25 +70 oc table 8-2: i/o and reset level parameter min typical max unit i/o supply voltage (vdd_io) 3.0 3.3 3.6 v i/o voltage levels v il input logic levels low 0 ? 0.8 v v ih input logic levels high 2.0 ? 3.6 v v ol output logic levels low ? ? 0.4 v v oh output logic levels high 2.4 ? ? v rst_n threshold voltage ? 1.6 ? v table 8-3: battery charger parameter min typical max unit adap_in input voltage 4.5 5.0 5.5 v supply current to charger only ? 3 4.5 ma maximum battery fast charge current headroom > 0.7v (adap_in = 5v) ?350?ma headroom = 0.3v~0.7v (adap_in = 4.5v) ?175 (note 2) ?ma trickle charge voltage threshold ?3?v battery charge termination current, (% of fast charge current) ?10?% table 8-4: led driver parameter min typical max unit open-drain voltage ? ? 3.6 v programmable current range 0 ? 5.25 ma intensity control ? 16 ? step current step ? 0.35 ? ma power down open-drain current ? ? 1 a shutdown current ? ? 1 a
? 2016 microchip technology inc. ds60001403a - page 49 BM62/64 note 1: f in = 1 khz, b/w = 20~20 khz, a-weighted, thd+n < 1%, 150 mv pp input. 2: these parameters are characterized but not tested in manufacturing. table 8-5: audio codec analog to digital converter t = 25 o c, v dd = 2.8v, 1 khz sine wave input, bandwidth = 20 hz~20 khz parameter (condition) min typical max unit resolution ? ? 16 bit output sample rate 8 ? 48 khz signal to noise ratio (note 1) (snr at mic or line-in mode) ?92?db digital gain -54 ? 4.85 db digital gain resolution ? 2~6 ? db mic boost gain ? 20 ? db analog gain ? ? 60 db analog gain resolution ? 2.0 db input full-scale at maximum gain (differential) ? 4 ? mv/rms input full-scale at minimum gain (differential) ? 800 ? mv/rms 3db bandwidth ? 20 ? khz microphone mode (input impedance) ? 24 ? kohm thd+n (microphone input) at 30 mv/rms input ? 0.02 ? %
BM62/64 ds60001403a - page 50 ? 2016 microchip technology inc. note 1: f in = 1 khz, b/w = 20~20 khz, a-weighted, thd+n < 0.01%, 0dbfs signal, load = 100 kohm 2: f in = 1 khz, b/w = 20~20 khz, a-weighted, -1dbfs signal, load=16 ohm 3: f in = 1 khz, b/w = 20~20 khz, a-weighted, thd+n < 0.05%, 0dbfs signal, load = 16 ohm 4: these parameters are characterized but not tested in manufacturing. note 1: the rf tx power has modulation value. 2: the rf transmit power is calibrated during production using the mp tool and mt8852 bluetooth test equip- ment. 3: test condition: vcc_rf = 1.28v, temperature +25 oc. table 8-6: audio codec digital to analog converter t = 25 o c, v dd = 2.8v, 1 khz sine wave input, bandwidth = 20 hz~20 khz parameter (condition) min typical max unit over-sampling rate ? 128 ? f s resolution 16 ? 20 bit output sample rate 8 ? 48 khz signal to noise ratio (note 1) (snr at capless mode) for 48 khz ?98?db signal to noise ratio (note 1) (snr at single-ended mode) for 48 khz ?98?db digital gain -54 ? 4.85 db digital gain resolution ? 2~6 ? db analog gain -28 ? 3 db analog gain resolution ? 1 ? db output voltage full-scale swing (avdd = 2.8v) 495 742.5 ? mv/rms maximum output power (16 ohm load) ? 34.5 ? mw maximum output power (32 ohm load) ? 17.2 ? mw allowed load resistive ? 16 o.c. ohm capacitive ? ? 500 pf thd+n (16 ohm load) (note 2) ?0.05?% signal to noise ratio (snr at 16 ohm load) (note 1) ?98?db table 8-7: transmitter section for bdr and edr parameter min typical max bluetooth specification unit maximum rf transmit power class 1 ? 15.0 (3) ?< 20dbm class 2 ? 2 (3) ?-6 to 4dbm edr/bdr relative transmit power -4 -1.8 1 -4 to 1 db
? 2016 microchip technology inc. ds60001403a - page 51 BM62/64 note 1: test condition: vcc_rf = 1.28v with temperature +25 oc. 2: these parameters are characterized but not tested in manufacturing. note 1: the measurement data corresponds to firmware v1.0. 2: mode definition: stand-by mode: power-on without bluetooth link; link mode: with bluetooth link in low-power mode. 3: current consumption values are considered with the BM62 validation board as test platform, bat_in = 3.8v. the distance between the smartphone and evb is 30 cm, and the speaker is without loading. . table 8-8: receiver section for bdr and edr modulation min typical max bluetooth specification unit sensitivity at 0.1% ber gfsk ? -89 ? -70 dbm sensitivity at 0.01% ber /4 dqpsk ? -90 ? -70 dbm 8dpsk ? -83 ? -70 dbm table 8-9: system current consumption of BM62 system status typical (1) max unit system-off mode ? 10 a stop advertising (samsung s5 (sm-g900i)/android 4.4.2) stand-by mode 0.57 ? ma link mode 0.5 ? ma esco link 15.1 ? ma a2dp link 14.3 ? ma stop advertising (iphone 6/ios 8.4) stand-by mode 0.6 ? ma link mode 0.6 ? ma sco link 15.3 ? ma a2dp link 15.4 ? ma
BM62/64 ds60001403a - page 52 ? 2016 microchip technology inc. 8.2 timing specifications figure 8-1 and figure 8-2 illustrate the clock and data timing diagram of the BM62/64 module. figure 8-1: timing diagram for i 2 s modes (master/slave) figure 8-2: timing diagram for pcm modes (master/slave) note 1: f s : 8 khz,16 khz, 32 khz, 44.1 kh z, 48 khz, 88.2 khz and 96 khz. 2: sclk0: 64* f s /256* f s . 3: word length: 16-bit and 24-bit.
? 2016 microchip technology inc. ds60001403a - page 53 BM62/64 figure 8-3 illustrates the audio interface timing diagram and tab l e 8 - 10 provides the audio interface timing specifications. figure 8-3: audio interface timing diagram note: test conditions: slave mode, f s = 48 khz, 24-bit data and slk0 period = 256 f s . table 8-10: audio interface timing specifications parameter symbol min typ max unit sclk0 duty ratio d sclk ?50?% sclk0 cycle time t sclkcy 50 ? ? ns sclk0 pulse width high t sclkch 20 ? ? ns sclk0 pulse width low t sclkcl 20 ? ? ns rfs0 set-up time to sclk0 rising edge t rfssu 10 ? ? ns rfs0 hold time from sclk0 rising edge t rfsh 10 ? ? ns dr0 hold time from sclk0 rising edge t dh 10 ? ? ns
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? 2016 microchip technology inc. ds60001403a - page 55 BM62/64 9.0 soldering recommendations the BM62/64 module is assembled using a standard lead-free reflow profile, ipc/jedec j-std-020. the BM62/64 module can be soldered to the main pcb using a standard leaded and lead-free solder reflow profiles. to avoid the damage to the module, follow these recom- mendations: ? refer to microchip technology application note ? an233 solder reflow recommendation ? (ds00233) for the soldering reflow recommenda- tions ? do not exceed peak temperature (t p ) of +250 oc ? refer to the solder paste data sheet for specific reflow profile recommendations ? use no-clean flux solder paste ? do not wash, as moisture can be trapped under the shield ? use only one flow. if the pcb requires multiple flows, apply the module on the final flow. figure 9-1 illustrates the reflow profile of the BM62/64 module. figure 9-1: reflow profile
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? 2016 microchip technology inc. ds60001403a - page 57 BM62/64 10.0 ordering information table 10-1 provides the ordering information of the BM62/64 module. note: the BM62/64 module can be purchased through a microchip representative. go to microchip web site www.microchip.com for current pricing and a list of distributors for the product. table 10-1: BM62/64 modul e ordering information module microchip ic description shield part no. BM62 is2062gm bluetooth 4.2 stereo audio module, class 2 with rf shield yes BM62spks1mc2 BM62 is2062gm bluetooth 4.2 stereo audio module, class 2 without rf shield no BM62spka1mc2 bm64 is2064gm bluetooth 4.2 stereo audio module, class 2 with rf shield yes bm64spks1mc2 bm64 is2064gm bluetooth 4.2 stereo audio module, class 2 without rf shield no bm64spka1mc2 bm64 is2064gm bluetooth 4.2 stereo audio module, class 1 with rf shield yes bm64spks1mc1 bm64 is2064gm bluetooth 4.2 stereo audio module, class 1 without rf shield no bm64spka1mc1
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? 2016 microchip technology inc. ds60001403a - page 59 BM62/64 appendix a: certification notices the BM62/64 stereo audio module will cover regulatory approval for following countries: ? united states; fcc id: (in progress) ? canada, ic id: (in progress) ? europe: (in progress) ? japan: (in progress) ? korea: (in progress) ? taiwan; ncc no: (in progress) ? china: cmiit id: (in progress) a.1 regulatory approval this section outlines the regulatory information for the BM62/64 stereo audio module for the following countries: ? united states ? canada ? europe ? japan ? korea ? taiwan ? china ? other regulatory jurisdictions a.2 united states the BM62/64 stereo audio module has received f ederal communications commission (fcc) cfr47 telecom- munications, part 15 subpart c ?intentional radiators? modular approval in accordance with part 15.212 mod- ular transmitter approval. modular approval allows the user to integrate the BM62/64 module into a finished product without obtaining subse quent and separate fcc approvals for intentional radiation, provided no changes or modifications are made to the module cir- cuitry. changes or modifications could void the user?s authority to operate the equipment. the user must com- ply with all of the instructions provided by the grantee, which indicate installation and/or operating conditions necessary for compliance. the finished product is required to comply with all appli- cable fcc equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. for example, com- pliance must be demonstrated to regulations for other transmitter components within the host product; the requirements for unintentional radiators (part 15 sub- part b ?unintentional radiators?), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., verification, or declaration of conformity) (e.g., transmitter modules may also contain digital logic func- tions) as appropriate. a.2.1 labeling and user information requirements the BM62/64 stereo audio module has been labeled with its own fcc id number, and if the fcc id is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. this exterior label can use wording as follows: a user?s manual for the finished product must include the following statement: additional information on labeling and user information requirements for part 15 devices can be found in kdb publication 784748 available at the fcc office of engi- note: this device has not been authorized as required by the rules of the federal com- munications commission. this device is not, and may not be offered for sale or lease, or sold or leased, until authorization is obtained. contains transmitter module fcc id: or contains fcc id: this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation this equipment has been tested and found to comply with the limits for a class b digital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this equip- ment generates, uses and can radiate radio fre- quency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. however, there is no guarantee that interference will not occur in a particular installation. if this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the follow- ing measures: ? reorient or relocate the receiving antenna ? increase the separation between the equipment and receiver ? connect the equipment into an outlet on a circuit different from that to which the receiver is con- nected ? consult the dealer or an experienced radio/tv technician for help
BM62/64 ds60001403a - page 60 ? 2016 microchip technology inc. neering and technology (oet) laboratory division knowledge database (kdb) http://apps.fcc.gov/oetcf/kdb/index.cfm a.1.3 rf exposure all transmitters regulated by fcc must comply with rf exposure requirements. kdb 447498 general rf exposure guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to radio frequency (rf) fields adopted by the federal communications commission (fcc). from the fcc grant: output power listed is conducted. this grant is valid only when the module is sold to oem integrators and must be installed by the oem or oem integrators. this transmitter is restricted for use with the specific antenna(s) tested in this application for certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with fcc multi-transmitter product procedures. a.1.4 helpful web sites federal communications commission (fcc): http://www.fcc.gov fcc office of engineering and technology (oet) lab- oratory division knowledge database (kdb): http://apps.fcc.gov/oetcf/kdb/index.cfm a.2 canada the BM62/64 stereo audio module has been certified for use in canada under industry canada (ic) radio standards procedure (rsp) rsp-100, radio stan- dards specification (rss) rss-gen and rss-247. modular approval permits the installation of a module in a host device without the need to recertify the device. a.2.1 labeling and user information requirements labeling requirements for the host device (from sec- tion 3.1, rss-gen, issue 4, november 2014): the host device shall be properly labeled to identify the module within the host device. the industry canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the industry canada certification number of the module, preceded by the words ?contains transmit- ter module?, or the word ?contains?, or similar wording expressing the same meaning, as follows: user manual notice for license-exempt radio appara- tus (from section 8.4 rss-gen, issue 4, november 2014): user manuals for license-exempt radio appara- tus shall contain the following or equivalent notice in a conspicuous location in the user manual or alterna- tively on the device or both: transmitter antenna (from section 8.3 rss-gen, issue 4, november 2014): user manuals for transmitters shall display the following notice in a conspicuous loca- tion: the above notice may be affixed to the device instead of displayed in the user manual. a.2.2 rf exposure all transmitters regulated by ic must comply with rf exposure requirements listed in rss-102 - radio fre- quency (rf) exposure compliance of radio communi- cation apparatus (all frequency bands). a.2.3 helpful web sites industry canada: http://www.ic.gc.ca/ contains transmitter module ic: this device complies with industry canada license-exempt rss standard(s). operation is sub- ject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. le prsent appareil est conforme aux cnr d'indus- trie canada applicables aux appareils radio exempts de licence. l'exploitation est autorise aux deux con- ditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. under industry canada regulations, this radio trans- mitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the trans- mitter by industry canada. to reduce potential radio interference to other users, the antenna type and its gain must be so chosen that the equivalent isotropi- cally radiated power (e.i.r.p.) is not more than that necessary for successful communication. conformment la rglementation d'industrie can- ada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par industrie can- ada. dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablisse- ment d'une communication satisfaisante.
? 2016 microchip technology inc. ds60001403a - page 61 BM62/64 a.3 europe the BM62/64 stereo audio module is an r&tte direc- tive assessed radio module that is ce marked and has been manufactured and tested with the intention of being integrated into a final product. the BM62/64 stereo audio module has been tested to r&tte directive 1999/5/ec essential requirements for health and safety (article (3.1(a)), electro magnetic compatibility (emc) (article 3.1(b)), and radio (article 3.2) and are summarized in table a-1:?european compliance testing? . a notified body opinion has also been issued. the r&tte compliance association provides guid- ance on modular devices in document technical guid- ance note 01 available at http://www.rtteca.com/html/download_area.htm a.3.1 labeling and user information requirements the label on the final product which contains the BM62/64 stereo audio module must follow ce marking requirements. the r&tte compliance association technical guidance note 01 provides guidance on final product ce marking. a.3.2 antenna requirements from r&tte compliance association document tech- nical guidance note 01 : provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio mod- ule manufacturer's installation instructions requires no further evaluation under article 3.2 of the r&tte directive and does not require fur- ther involvement of an r&tte directive notified body for the final product. [section 2.2.4] the european compliance testing listed in table a-1:?european compliance testing? was performed using the pcb trace antenna. a.3.3 helpful websites a document that can be used as a starting point in understanding the use of short range devices (srd) in europe is the european radio communications committee (erc) recommendation 70-03 e, which can be downloaded from the european radio commu- nications office (ero) at: http://www.ero.dk/ additional helpful web sites are: ? radio and telecommunications terminal equip- ment (r&tte): http://ec.europa.eu/enterprise/rtte/index_en.htm ? european conference of postal and telecommu- nications administrations (cept): http://www.cept.org ? european telecommunications standards insti- tute (etsi): http://www.etsi.org ? european radio communications office (ero): http://www.ero.dk ? the radio and telecommunications terminal equipment compliance association (r&tte ca): http://www.rtteca.com/ note: to maintain conformance to the testing listed in table a-1:?european com- pliance testing? , the module shall be installed in accordance with the installa- tion instructions in this data sheet and shall not be modified. when integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the r&tte directive. table a-1: european compliance testing certification standards article laboratory report number date safety en60950-1:2006/a11:2009+a1:2 010+a12:2011+a2:2013 [3.1(a)] ? ?? health etsi en 300 328 v1.9.1 en62479:2010 ?? emc en300 489-1 v1.9.2 [3.1(b)] ? ? en301 489-17 v2.2.1 radio etsi en 300 328 v1.9.1 (3.2) ? ? notified body ? ? ? ? ?
BM62/64 ds60001403a - page 62 ? 2016 microchip technology inc. a.4 japan the BM62/64 stereo audio module has received type certification and is labeled with its own technical confor- mity mark and certification number as required to con- form to the technical standards regulated by the ministry of internal affairs and communications (mic) of japan pursuant to the radio act of japan. integration of this module into a final product does not require additional radio certification provided installa- tion instructions are followed and no modifications of the module are allowed. additional testing may be required: ? if the host product is subject to electrical appli- ance safety (for example, powered from an ac mains), the host product may require product safety electrical appliance and material (pse) testing. the integrator must contact their confor- mance laboratory to determine if this testing is required. ? there is an voluntary electromagnetic compatibil- ity (emc) test for the host product administered by vcci: http://www.vcci.jp/vcci_e/index.html a.4.1 labeling and user information requirements the label on the final product which contains the BM62/64 stereo audio module must follow japan mark- ing requirements. the integrator of the module must refer to the labeling requirements for japan available at the ministry of internal affairs and communications (mic) website. the BM62/64 stereo audio module is labeled with its own technical conformity mark and certification num- ber. the final product in which this module is being used must have a label referring to the type certified module inside: a.4.2 helpful web sites ministry of internal affairs and communications (mic): http://www.tele.soumu.go.jp/e/index.htm association of radio industries and businesses (arib): http://www.arib.or.jp/english/ a.5 korea the BM62/64 stereo audio module has received certi- fication of conformity in accordance with the radio waves act. integration of this module into a final prod- uct does not require additional radio certification pro- vided installation instructions are followed and no modifications of the module are allowed. a.5.1 labeling and user information requirements the label on the final product which contains the BM62/64 stereo audio module must follow kc marking requirements. the integrator of the module must refer to the labeling requirements for korea available on the korea communications commission (kcc) website. the BM62/64 stereo audio module is labeled with its own kc mark. the final product requires the kc mark and certificate number of the module: a.5.2 helpful web sites korea communications commission (kcc): http://www.kcc.go.kr national radio research agency (rra): http://rra.go.kr a.6 taiwan the BM62/64 stereo audio module has received com- pliance approval in accordance with the telecommuni- cations act. customers seeking to use the compliance approval in their product must contact microchip tech- nology sales or distribution partners to obtain a letter of authority. integration of this module into a final product does not require additional radio certification provided installa- tion instructions are followed and no modifications of the module are allowed. a.6.1 labeling and user information requirements the BM62/64 stereo audio module is labeled with its own ncc mark and certificate number as follows: the user's manual must contain below warning (for rf device) in traditional chinese: ? ! ????Ck
? 2016 microchip technology inc. ds60001403a - page 63 BM62/64 ?l ?JC???l?C?S ? ?????l??? ??O? ??? ??l ?l?C???w? ?_??? lF?_Fr??Ko?_r ^m? ???????I?o? ?l?C??????I?Wt ?? ?CO??_ a.6.2 helpful web sites national communications commission (ncc): http://www.ncc.gov.tw a.7 china the BM62/64 stereo audio module has received certi- fication of conformity in accordance with the china miit notice 2014-01 of state radio regulation committee (srrc) certification scheme. integration of this module into a final product does not require additional radio certification, provided installation instructions are fol- lowed and no modifications of the module are allowed. a.7.1 labeling and user information requirements the BM62/64 stereo audio module is labeled with its own cmiit id as follows: when host system is using an approved full modular approval (fma) radio: the host must bear a label containing the statement ?this device contains srrc approved radio module cmiit id xxxxxxxxxx?. a.8 other regulatory jurisdictions should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, contact micro- chip for the required utilities and documentation.
BM62/64 ds60001403a - page 64 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds60001403a - page 65 BM62/64 appendix b: revision history revision a (may 2016) this is the initial released version of this document.
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? 2016 microchip technology inc. ds60001403a - page 67 BM62/64 the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under ?support?, click on ?customer change notification? and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support customers must contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support
BM62/64 ds60001403a - page 68 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds60001403a - page 69 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, anyrate, dspic, flashflex, flexpwr, heldo, jukeblox, keeloq, keeloq logo, kleer, lancheck, link md, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. clockworks, the embedded control solutions company, ethersynch, hyper speed control, hyperlight load, intellimos, mtouch, precision edge, and quiet-wire are registered trademarks of micr ochip technology incorporated in the u.s.a. analog-for-the-digital age, any capacitor, anyin, anyout, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dynamic average matching, dam, ecan, ethergreen, in-circuit serial programming, icsp, inter-chip connectivity, jitterblocker, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, puresilicon, righttouch logo, real ice, ripple blocker, serial quad i/o, sqi, superswitcher, superswitcher ii, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered tradem arks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2016, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 978-1-5224-0576-4 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
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